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Real-time high-definition BGA inspection systems ‘see’ what other technologies cannot

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Real-time high-definition BGA inspection systems ‘see’ what other technologies cannot

Real-time high-definition BGA inspection systems ‘see’ what other technologies cannot
Optilia high-definition digital BGA inspection system. Source: Optilia Instruments
Optilia Instruments’ high definition optical BGA inspection systems go where nothing else can go, beneath low stand-off BGAs to find micro-cracks, cold solder joints, whisker, scaling, excess flux and other soldering issues that high-priced X-ray systems can’t detect. The BGA inspection systems feature the tiniest optical probes available and 5.0 megapixel digital image cameras in a robust system that produce high-resolution pictures of the extremely low-clearance areas beneath BGAs, μBGAs, CSP and FlipChip packages with as low as 40 microns stand-off.

For example, Optilia’s new generation 90° side view BGA inspection system is remarkable for its ability to penetrate deeply under very low-standoff BGAs and yet provide a clear, bright image. Its variable focus capability allows the user to image from one to up to 20 rows of BGA bumps with its flexible, electronically-dimmable brush-light or micro-prism background illumination. The company offers the tiniest BGA probe on the market (0.4×3.4 mm foot print) and unbeatable magnification of up to 350x on a 24” monitor for optimum detail and ease of visual analysis. The company provides the highest resolution BGA system available for a crisp picture with more details than any other. A larger Field of View makes hidden balls and rows more visible, and hard-to-detect defects including solder joint micro cracks are easily discernible. Top-view attachable varifocal lenses with built-in LED lighting provide top inspection capability as well. Configurable BGA inspection systems offer flexibility in magnification, probe tip size and in lighting adjustment. Clear, crisp real-time images are obtained through many different configuration options, and innovative features and components including an detachable BGA lens, built-in LED incident front illumination with electronic dimming, exchangeable stainless-steel housing optical probes; a digital video microscope with 5.0MP image sensor; attachable fixed-focal length or varifocal lenses; different software options; and much more.
productronica, Booth A2.249
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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2023
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