Each month, Speedline Technologies offers a webinar free of charge on a topic relevant to process engineers in OEM and contract electronics manufacturing. On Thursday, October 18th , 2007, a webcast will be offered on upstream solder joint defect inspection and the transition from “quality through inspection” to “quality through design,” with a concentration on the printing process. The presentation lasts one hour and commences at 11:00 am Eastern time.
It is a well-known fact that the cost of a defect increases dramatically the further along in the manufacturing process it is identified. Defect prevention is of course ideal, but early defect prediction and detection will reduce costs relative to identification after soldering. This seminar will address the correlation between paste defects found upstream (after paste printing) and solder joint defects found after reflow.
Specific areas of discussion will include an overview of the printing process, different inspection techniques, the effects of components and paste types on defects, and a review of experimental research currently underway. The ultimate goal is to predict the likelihood of solder joint defects before they occur and to adjust design and processes to limit their occurrence, resulting in higher quality and lower costs.
To register for the webcast seminars, go to www.speedlinetech.com/seminars and complete the short contact information form. After registration, an email is sent with the website access address and the toll-free phone conference number. No special hardware or software is required, just high speed internet access and a telephone. A detailed schedule is provided on the web page above providing monthly topics and information on the webinar schedule for the remainder of 2007.
EPP Europe 412
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