The three trade fairs of SMT/Hybrid/Packaging, PCIM Europe and Sensor & Test will be taking place in parallel from 30 May to 1 June 2006 at the Nuremberg Exhibition Centre. The benefits are obvious: the combination of the three events with their complementary topics will offer an even greater spectrum of products and activities and will appeal to even more potential visitors. A visitor ticket to one event offers entry to the other two.
The positive mood in the branch is reflected in the SMT/Hybrid/Packaging 2006 figures, with over 80 % of the exhibition space already booked. The countdown to lead-free will be the exhibition topic. New solutions and the latest developments in this area will be on show at SMT/Hybrid/Packaging 2006, which will act as the branch’s most important platform for the exchange of ideas and experiences in the conversion process. Apart from this, the participating companies will be presenting once again the complete product spectrum from PCBs, solders, screen printing and hybrids to placement technologies and many other innovations in the electronics sector.
Responding to the trend towards ‘wireless’ technology, VDI/VDE-IT together with partners from industry and scientific community will demonstrate on a modern production line which components, interconnection technologies, and packaging solutions can be used to achieve these autonomous, intelligent sensors with a volume of less than 1 cm3. A service point lead free is expected to be the exhibition’s key attraction. Just one month before the deadline for the ‘Change over to lead-free production’, ‘RoHS’ and ‘WEEE’ will meet experts at the event to discuss the final details of the process and to propose suitable solutions and products. Answers to last minute questions will be provided at the accompanying forums and debates.
The most important practical conference on assembly production and system integration in Europe will take place at the same time as the exhibition. At the heart of the 2006 program is a day’s session on ‘Technologies for the Third Dimension (heterointegration) in PCB production‘.
EPP EUROPE 409
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