KSW Microtec has developed a new generation of thinnest RFID prelaminates for eGovernment, ePayment and High Security applications. eID cards require those to enable the implementation of a variety of additionally needed card layers for security features and not to exceed the allowed card thickness. The prelaminates of the Thinlam family are extremely thin and enable the manufacturing of HF and UHF RFID cards with multiple layers, due to the thickness down to 200 µm. As the Thinlams are manufactured without chip modules, they ensure an exceptionally plane card surface without sink marks. Furthermore the prelaminates maintain the highest durability thanks to the patented chip connection technology, achieving tighter resonance frequency tolerances. Thinlam is available in polycarbonate, PVC, PET or Teslin and can also be used for transparent RFID cards due to the excellent optical appearance.
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