SMT/Hybrid/Packaging set to take place from June 3 rd to 5 th , 2008, in Nuremberg. The total space booked so far for this year’s trade fair for system integration in micro electronics has exceeded all previous events – with an exhibition space of over 27.600 sqm. National and international exhibitors will display and explain how today´s burning issues of production in the highly miniaturised electronics world may be solved in an economic approach. The leading companies from 22 nations have already confirmed their stand booking. The high percentage of foreign exhibitors (more than 30 % of the exhibitors from abroad) underlined the show’s international importance.
From June 3rd to 5th , 2008, a whole range of solutions, products and services relating to system integration in micro electronics will be on show in Nuremberg. The exhibition will provide a comprehensive overview of topics including design and development, PCB production, components, placement technologies and test equipment all under one roof. In addition, there are many more highlights waiting for the visitors, such as forum presentations and many special features at this year’s show.
The production line in Hall 7, presented jointly by “VDI/VDE Innovation + Technik GmbH” and partners from industry and research, promises to be a real hit. Under the motto: “Automotive Electronics – technological and logistical challenges in assembly manufacturing” the VDI/VDE will show which highlights and challenges during the production of assemblies for automotive applications exist and which requirements of process reliability, quality assurance and assembly logistic are involved.
Each day of the exhibition visitors will be able to visit the “Process Advice & Defect Clinic” led by international consultant and lead-free auditor Bob Willis with questions, process issues or defects for examination and discussion. This is an ideal opportunity to gain practical independent advice on the most common causes of production problems and field failure. In hall 9 stand 205, visitors can bring printed circuit boards and assemblies for inspection and no nonsense independent advice free at SMT. Bob Willis will have optical and X-ray inspection equipment available to show visitors what is the root cause of common production problems.
The advent of optical technologies is another important topic in electronics. The trend-setting advantage of optical joining techniques in essential areas is a decisive aspect here. Under the conceptual auspices of the “Fraunhofer IZM”, companies show their know-how on key topics.
During the exhibition a public benchmark test of stencil printers will take place at the trade show at the EPP-Benchmark-Arena, presented and organised by Konradin Media. The exhibition forums will offer a 3-day comprehensive programme. Numerous companies will present their products, solutions and services, and sector experts will discuss, amongst others, topics such as “China RoHS: Stand and consequences on assembly production”, “Traceability” and “LGA/QFP Inspection and Rework Guide”.
The conference with tutorials, taking place concurrently with the exhibition, is a very important application-oriented meeting point of the micro electronics industry, providing insight into and the opportunity to discuss the latest research results, solutions and user experience.
The conference day on June 4 th, 2008, (held in German) will deal with “Requirements on Electronic Assemblies for Automotive Manufacturing”, looking into those assembly technologies offering the necessary potential to meet the challenges of increasing competition on the global market. 13 renowned speakers from industry and research will provide insight into various aspects, following an opening presentation by BMW Munich. In addition, 23 half-day tutorials are on the program on June 3 rd and 5 th, 2008, six of them presented in English. The variety of topics spans the entire value adding chain of electronic assembly production, from design through process technology to quality assurance.
EPP Europe 421
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