Assemblies used in adverse climatic conditions, such as humidity and temperature fluctuations, require a suitable protective coating to prevent dangerous malfunctions and failures in the field. However, due to possible impurities remaining on the assembly from the soldering process, coating alone does not sufficiently protect against failures.
Even though cleaning significantly increases the coating’s reliability, it ultimately means additional costs and is therefore often dismissed. Zestron recently investigated if there is a possible compromise that would justify the integration of a cleaning process without increasing overall production costs. In a subsequent step, the total potential savings realized by a prior cleaning process were determined with regard to material and process costs as well as environmental factors such as VOC emissions.
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