After an intensive three days, the SMT Hybrid Packaging event can look back at a successful exhibition and conference on system integration in microelectronics. 434 exhibitors presented their solutions; these reflected all the technical processes involved in the production of electronic assemblies.
“The SMT Hybrid Packaging event is extremely important for us at Fuji Europe Corporation: Here we can maintain and develop contacts in central Europe, which is our main sales region. I would actually claim that if you aren’t here, you aren’t very successful on the market,” confirmed Stefan Janssen, Assistant General Manager.
Around 12,000 visitors from around the world were able to gain an excellent overview of the entire value chain and network within the industry. Visitor highlights included the „Future Packaging“ production line for „Smart Motion – Intelligent Automation for E-Mobility and Robotics“ as well as the IPC Hand Soldering Competition, in which not only professionals but also young professionals were able to participate for the first time.
The conference and tutorials once again provided the 203 participants with numerous solution-oriented training opportunities and enabled direct dialogue with experts.
Established event with new name in 2019
From 2019, the event will undergo a name change. SMT Hybrid Packaging will become SMTconnect: solutions for electronic assemblies and systems.
The new event name describes the core of the event in thereby reflecting its clear focus. It will bring together people and technologies from the areas of development, production, services and application of microelectronic assemblies and systems, creating important and valuable connections.
„The solution-oriented event provides the community with optimal conditions to exchange knowledge and ideas as well as jointly master the current challenges in microelectronics,“ explains Anthula Parashoudi, responsible division manager at Mesago Messe Frankfurt GmbH.
In addition, SMTconnect aims to bring more developable subjects into focus. In 2019, the topic of „Electronic Manufacturing Services“ will be added to the portfolio.
The SMTconnect will be taking place in Nuremberg from 7 – 9 May 2019.
