To be able to offer better service to its European customers, Orthodyne has recently opened two new subsidiaries in Germany: the newly founded Orthodyne Electronics GmbH based in Edling/Munich, complemented by a technical support office in Nuremberg, which are to serve also the Eastern European markets. All these locations offer training, support and demonstrations of the ultrasonic wedge bonders for thin and thick wires, as well as the Power Ribbon Technology.
As in the years before, Orthodyne in 2005 gained the top position in the annual “Customer Satisfaction Survey on Chip Making Equipment” of VLSI Research Inc. As a manufacturer of assembly equipment, Orthodyne achieved best grades in the categories Technological Leadership Position, After-Sales Support, Product Properties, Availability and Cost of Ownership.
EPP EUROPE 406
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