Siemens Electronics Assembly Systems (EA) expands its product portfolio beyond Siplace SMT placement solutions with the addition of the new Siplace OS inline inspection system, being demonstrated on Stand D30 at the Nepcon UK show in Birmingham. According to the company the Siplace OS is the world’s first optical inspection system to combine two-dimensional and three-dimensional inspection features.
This will significantly reduce setup times in electronics manufacturing, as new products can be added to the production line in the shortest period of time based on 3-D measurements and the component shape library which is independent of component variants, such as colours. No matter where it is placed within the line, (post paste, pre- and post reflow as well as mixed mode), the optical inspection system ensures flawless and fully documented quality. Electronic modules are becoming increasingly complex. As soldering spots are getting smaller and placement densities are larger, while components are getting smaller, the quality requirements in electronics manufacturing are steadily on the rise. With the help of 2-D/3-D parallel inline system, manufacturers can now implement process control and automatic inspection requirements on the factory floor quickly and with exceptional precision.
The system is a fully automated high-speed machine for automatic optical inspection (AOI). It employs the 3-D triangulation principle to inspect inline and without slowing down the line, all features that lend themselves to optical inspection: the solder paste application with areas, shape and position; the correct positioning of components including their polarity and the finished product after the soldering phase. Depending on the specific requirements and process requirements, the position of each of the firm’s inspection system within the line can be easily changed.
The system employs the 3-D triangulation process which performs very quickly and simultaneously not only 2-D, but also true 3-D height measurements. Unlike most other systems, the Siplace OS does not perform its 3-D measurements in a separate and time-consuming testing step with a laser, but simultaneously and across the entire PCB surface.
The system uses triangulation to generate a precise topographical map of the test subject. As a result, component colour or board colour, as well as the components’ position on the board play no role since the system operates independently of these factors. Each component shape requires only a single description, and no supplemental teaching after product changeovers is needed, which reduces the time required for new product introductions to a minimum. By adding automatic optical inspection to its product portfolio, the company team further expands its technology leadership in electronics manufacturing and is now able to design comprehensive SMT placement solutions for its customers that guarantee maximum quality in all segments of the process chain. The optical inspection system plays an important role in this concept since its integrated 2-D/3-D inspection eliminates most sources of problems reliably and cost-effectively – and it does so directly on the line without slowing down production.
Nepcon UK, D30
EPP Europe 457
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