New technologies and materials present viable and reliable options for use in tomorrow’s electronic products, even with the continuing proliferation of environmental regulation restrictions. As the electronics industry seeks to contain costs and find new efficiencies for high-density electronics, nanotechnology and embedded passives are offering new solutions to help the industry meet today’s challenges. Understanding the opportunities presented by new materials and technologies and their related reliability and performance is the focus of the IPC Materials Conference: Engineering for Compliance, November 11, 2009, in Irvine, Calif.
Engineers have been concerned about the viability of embedded passives in conjunction with the higher temperatures required by lead-free materials. Joel Peiffer of 3M’s Electronic Solutions Division will explore the issue in his paper, Reliability of Ultra-Thin Embedded Capacitor Laminates in Lead-Free Assembly. “I’m presenting data to help calm those fears, showing that even materials that have not been around a long time are extremely reliable,” Peiffer said.
Another highlight of the conference will be a keynote by Alan Rae examining opportunities and challenges as nano-enabled products go mainstream in the next five years. Perhaps the biggest and earliest link between nano and printed board technology is the conductive inks that use nanotubes to improve conductivity. Rae predicts that companies in the printed board industry who start studying materials like these stand to benefit significantly during the coming decade. Papers and more Information are available at www.ipc.org/compliance-materials-conference.
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