Nano Dimension, a provider of additively manufactured electronics/3D-printed electronics (AME/PE) technologies, has formed a partnership with German developer of sensor solutions for defence and security applications, Hensoldt to advance the development of 3D-printed electronic components. The joint venture is named J.A.M.E.S (Jetted Additively Manufactures Electronics Sources). The new entity will comprise a cloud presence where members from across the world can develop and exchange AME and PE designs and products, as well as a laboratory to provide prototyping services and AME applications.
The joint venture will be led by Hensoldt Ventures, an independent unit within the company which implements and brings to market new technologies and business models for the Group.
Hensoldt has been working with Nano Dimension, a manufacturer of intelligent machines which 3D-print additively manufactured electronics (AME), since 2018 on the fabrication of high-performance-electronic-devices (known as HiPEDs). By formalizing their cooperation and co-investing approximately USD 6 million (EUR in J.A.M.E.S, Hensoldt is strengthening its commitment to developing the most advanced technology in 3D printing.
According to Hensoldt, J.A.M.E.S will be based in Taufkirchen, Germany, and will combine the strengths of both companies to further advance the development of 3D-printed electronic components. The main objective of the venture is the development of an electronic designer’s community that will exchange designs and methodologies for manufacturing, component integration, and materials for Printed Electronics (PE) and Additively Manufactured Electronics (AME).
By connecting the complete value chain of all designers and users-of-designs across corporate and geographical borders, J.A.M.E.S will allow members of its community to develop, prototype, market, and trade AME and PE designs, proof of concepts, and products, the companies explained in a press release.
Beyond its cloud presence, J.A.M.E.S will house an operating fabrication laboratory for the experimentation and support of designs and technologies from the J.A.M.E.S community. This will make it capable of not only being a community for ideation, but a platform to provide prototyping services and AME applications for industry users and its community of members, the company said.
Head of Hensoldt Ventures, Marian Rachow, who will serve on the J.A.M.E.S Board of Directors, commented, “Hensoldt, as a market leader in the field of sensor technology and optronics, expects the closer cooperation with Nano Dimension to accelerate development cycles as well as spare parts production to respond to customer needs more quickly and cost-effectively. Using special dielectric and conductive nanoparticle inks, it is now possible to design electrical components directly via the printer and bring them into a three-dimensional form.”
“Hensoldt has been investing in basic research of digital 3D printing of electronic components for several years to make the benefits of this technology available for its own development and production. For example, in collaboration with Nano Dimension, Hensoldt has already printed the world’s first 10-layer PCB, which carries soldered high-performance electronic structures on both outer sides, using a newly developed polymer ink from Nano Dimension. Increasing competition and accelerated customer procurement timelines will be one of the biggest challenges for established providers in the future. Our joint venture, J.A.M.E.S, not only offers rapid development of technology as a real alternative to conventional electronics manufacturing, but also offers small and medium-sized companies the opportunity to efficiently design new products,” Rachow added:
Yoav Stern, CEO of Nano Dimension, who will serve as Chairman on the J.A.M.E.S Board of Directors, stated, “I am confident that the co-investment of a supplier of transformative technologies such as Nano Dimension, and an early innovative, advanced adopter, committed to added value disruption such as Hensoldt, will produce game changing electronic solutions for both suppliers and users of AME/PE. We are on the verge of a revolution in 3D electronic additive manufacturing and are excited to establish a strong ecosystem to drive the development of AME with Hensoldt. J.A.M.E.S GmbH establishes a strong foundation for a world-wide network to foster research, innovation and ultimately the development of Hi-PEDs® in areas and industries still unexplored.
“The newly formed J.A.M.E.S is focused on building a cloud-based platform. In the future, other companies and customers are expected to upload a wide variety of electronic components in their usual CAD/CAM/CAE software and convert them into a new type of AME file on the platform. Furthermore, they will be able to obtain additional designs via the described platform, modify them, add their own form factor and have them printed on-demand,” Stern concluded.