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Methodology for developing cleaning process parameters

Reviewing the five-step method
Methodology for developing cleaning process parameters

Methodology for developing cleaning process parameters
Source: Kyzen

Kyzen, a provider of innovative environmentally friendly cleaning chemistries, is pleased to announce that Mike Bixenman, Ph.D., will present during Session S20, entitled Cleaning, on Wed., Jan 30, 2019 from 1:30–3:30 p.m. during the IPC Apex Expo. Bixenman will present the paper entitled, “Methodology for developing cleaning process parameters,” co-authored by Vladimir Sitko, PBT-Works and Mark McMeen, STI Electronics.

Electronic assembly processes range from the very simple to the very complex and involve a wide range of materials. Each step in the process and each material used will have some impact on the assembly, most affecting the cleaning process window.

The purpose of this research paper is to determine the feasibility of the five-step method for developing the cleaning process window followed by validating acceptability of the electronic assembly.

Dr. Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC cleaning handbook task group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.

Apex, Booth 3349

www.kyzen.com

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