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Member of the European Manufacturing Test Conference Committee

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Member of the European Manufacturing Test Conference Committee

Member of the European Manufacturing Test Conference Committee
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, is plea-sed to announce that James Quinn, Multitest’s Vice President of Marketing and Sales, was appointed as the latest member of the European Manufacturing Test Conference Committee (EMTC).

The company has been an integral part of the semiconductor industry for more than 30 years. They develop theis solutions in close collaboration with their customers, so have a thorough understanding of the requirements and trends in semiconductor test. Originally, the company’s focus was on providing test handling equipment. However, its extensive portfolio today comprises of test handlers (pick & place, gravity, strip), contactors (for array and inline packages, for Kelvin, WLSCP and RF applications) and load boards. This range and depth is unique – not just in Europe. Based on this, the company continuously develops comprehensive market insights that go beyond single product solutions.
Multitest is headquartered in Rosenheim, South of Munich and feels strongly committed to the European semiconductor business. All European IDMs work with the companies products. However, its global customer base requires and ensures that the company considers and leverages international trends and business relations.
James Quinn, VP Sales and Marketing, commented: “We are convinced that Multitest will be a vital contributor to the work of the European market view across borders and at the same time, we have a strong interest in the European semiconductor industry. We work closely with our partners in the semiconductor industry to provide leading solutions for future oriented applications. For example, the company is the first equipment supplier to deliver a full turn-key hardware set up for in-process test in 3D assembly. Our unique product portfolio enables us work in close partnership with our customers to develop comprehensive solutions for this emerging packaging technology that we see as a major strategic initiative in the semiconductor industry.”
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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