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Manufacturing technology to reach zero defect production

2. InnovationsForum Hungary
Manufacturing technology to reach zero defect production

As part of a series, InnovationsForum takes place in Germany, Hungary, and Mexico. The 2nd annual InnovationsForum Hungary occurred in the heart of Budapest with Kim Sauer as the moderator. Presentations occurred through the day that focused on how to best reach a zero defect production when so many conditions can influence the outcome.

Keynote: Tamás Péter Turcsán/ President of Startup Section at Hungarian Economic Association
Hungarian Innovation: Legend or Reality?
Influential in the startup community, Mr. Turcsán discussed the importance of innovation in manufacturing. It is important to follow new trends of business models, all while opening more channels and creating opportunities to connect start-ups with larger companies. Startup companies have great ideas, larger companies are seeking these great ideas, but there is a wall between these two environments, which need to be bridged together. The speaker also gave some insight into what will come next in the future, which is more automation, insisting that it will create more job opportunities.
Dr. Friedrich W. Nolting, Aegis Software
Process interlocking with dynamic sample adjustment- A way to zero defect production
Digital integration is of high importance and should be implemented throughout the entire process; therefore becoming paperless. All sectors of the process should be included, to build a better communication flow between operators and machines. This digital process needs to react quickly to any change of non-predesigned thresholds. It should also have self-learning processes. These features should include alarms going off when any irregularities occur, to no longer produce excess scrap. By integrating the entire process digitally, on average, NPI time has decreased from 24 hours to 6 hours and average productivity has increased by 10 %.
Claus Schultz/ Christian Koenen
New high tech materials for stencil printing
Complexity and miniaturization is making zero defect production more difficult to reach. However, when it comes to stencil printing, the material of the stencil is very important. The recently released Nanovate Nickel material is not only very flexible and has a longer lifespan, but it also has a high laser cutting result with a finer grain size. Furthermore, this has a better sealing of print deposits, which means it has a sharper, more defined cut edges on a PCB. For this company, innovation is vital part of their strategy, and creating a material with the most benefits, for a better, zero defect production for their customers is important.
Norbert Heilmann/ ASM
Interfaces for RFID and robots – Comprehensive automation and connectivity in the Smart SMT
Although automated factories are the reality of the future, most manufacturers are not yet equipped for this, as interfaces have been created for human beings to use, and not for machines. This is where new methods for interfaces need to be implemented, in order for both to work. For instance, the Siplace Bulk Feeder, component reels are no longer needed, replacing cartridges is easy, and a single filler can hold as many components as about 30 tapes. This means, no splicing is needed and waste is greatly reduced. According to the speaker, operators and workers cannot be forgotten when we are building towards automation. There needs to be an equal balance between the two when automating the production lines.
Jonas Ernst/ Fuji Machine MFG
Cutting Edge Technologies: for your high-quality pick and placement process
According to the speaker, there are four factors that affect quality: man, machine, material, and method. The main concept is to automate as much as possible, however, not everything can be automated. This means there is still a great need for operators, and guidance is essential to be the most productive. Creating an open communication between operators, as well as, all machines and software will enable each machine to learn how the operation should work. Lastly, being able to monitor the process at all times, even remotely, and analyzing the current situation of the process, will optimize all aspects of the line.
Karthik Vijay/ Indium Corporation
Minimizing QFN Voiding during SMT Assembly
There are three important aspects when engineering flux, which are decreasing the overall percentage of void, the positioning of the void, and breaking up the size of the void. Other aspects that should be considered when wanting to reduce the amount of voids are the peak temperature, the speed of the process window for the reflow profile, the texture of the flux, the temperature of the soaking process, the development of intermetallics at reflow, etc. The speaker also discussed some solutions that can be used, for instance, using a short reflow profile, using a long hot profile, as well as a vent or a vacuum soldering, as it decreases the amount and size of voids.
Rainer Krauss/ Ersa GmbH
Zero defect strategy- feasible or wishful thinking?
Giving the right tools to operators and having full control of the entire process, all while making machines more intelligent, is the key for a zero defect strategy. Requirements within manufacturing should be Smart, future oriented systems with modular design, flexible software platforms, and oriented towards Industry 4.0 or cloud based applications. In addition, it is imperative to know what is going on within the process at all times, from beginning to end. With the company’s Versacam, Versascan, and Versaeye, the process is controlled with sensors and cameras, ensuring that components are in the correct position and are not missing, all while documenting everything, from the beginning until the end.
Gábor Tójav/ Koh Young Europe GmbH
Zero defect production in the course of time
To be the most successful, the speaker discussed the importance of human-machine communication, implementing “the clever way” into your production, to be able to see the entire line from beginning to end, and not before it is too late. With the company’s solutions, all aspects of the line can be measured, controlled, and tracked, in order to give the best information to the operator. It is necessary to build communication between man and machine, combining them to create a clever platform, in order to handle large quantity of data. Being close to the process and recognizing all details will improve quality and performance of the production line.
Istvan Latos/ Nordson Matrix
Committed to Speed- Unique X-ray inspection systems and technologies setting new standards in high volume production environment
When using an inspection system, key factors should be followed in order to reach an optimal production. The first factor is to achieve the most speed and stability and to maximize the coverage of defects as much as possible. Being able to flexibly use 4 inspection technologies, Transmission 2D Imaging, Oblique 2.5D Imaging, Thomosynthesis 3D, and the company’s Slice Filter Technique, in one system, will minimize cycle time while inspecting all defects. Another important factor to follow is to not occupy the line by using an offline program approach and a global library. The final factor to ensure is proper calibration within each machine, to enable communication between all machines.
François Amblard/ ViTechnology
Reaching quality production faster by revealing and leveraging the information buried in SPI & AOI data
The speaker discussed how to confront some challenges that manufacturers are now having when using SPI and AOI machines. For example, to set tolerances intelligently, the Feed Forward concept should be used, which gathers all information from the SPI and AOI. Another problem that can arise is the compilation of large amounts of data. However, by using a smart purging process that focuses on only keeping important data, it becomes easier to go through a lot of information. Another challenge that can emerge is difficulties with data inspection and finding the root cause. The company uses a data analysis with drill down capabilities, which gives automatic attribution depending on where the defect is within the line. (cp)
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