Degussa and LPKF have closed an agreement for the use of a special plastic additive, and the marketing of molding compounds. The additive enables tracks and gaps to be directly transferred to the surface of three-dimensional devices, activated by laser. This has advantages for the production of 3D-MIDs (molded injection device) in mechatronics and microelectronics. With the LDS additive (laser-direct structuring) and the doped products, the Degussa High Performance Polymers division adds the molding compounds to its range of polybutylene-terephthalate material, which is resistant for a short time to temperatures of up to around +400°C. With this, the industry now has access to an innovative technology for the production of 3D-MIDs. The additive enables component surfaces to be activated with laser, and subsequently metalized. The device is reflow-solderable and therefore suitable for high-volume manufacturing. Circuit artwork can be realized on 3D carriers in just three steps – integrating the previously separate housing and PCB into one component. Also LPKF has signed an agreement on the laser-compatible modification of polymers with Bayer. This kind of plastics is suitable for the production of 3D interconnect devices. It is a very cost-effective way for instance to integrate antenna structures into hand-held electronic.
EPP EUROPE 412
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