Elfnet European Lead-Free Soldering Network has collaborated with Cost 531 to deliver a much-needed database of physical and mechanical properties for the new Tin-Silver-Copper (SnAgCu) lead-free solder alloys. This data is key to modelling behaviour of lead-free solder joints that from July 2006 will be at the heart of most electrical and electronic equipment in Europe. This database represents a key achievement in exploiting expertise in the academic research community to the direct benefit of the electronics industry. Since the introduction of lead-free soldering was first anticipated in the 1990s, collation of the huge amount of property data being generated has been a much-stated goal. Elfnet had identified the need for a new initiative in this area and in March 2005 it was agreed that this would be undertaken jointly with Cost 531, led by Clemens Schmetterer at the University of Vienna. Cost 531 is a network of over 60 universities across Europe, coordinated by University of Vienna, Austria. This resource has special expertise in metallurgical research and had already begun to generate data on lead-free solder alloys. The data is output as a user-friendly downloadable pdf file, with data presented clearly with diagrams, tables and detailed references. The first version of the new database was launched at the Semicon Europa 2006 exhibition in Munich in April 2006 and can accessed for free on the Elfnet website:
EPP EUROPE 404
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