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Lead-Free Experience and Other Highlights at Nepcon Show

Lead-Free Experience and Other Highlights at Nepcon Show

Lead-Free Experience and Other Highlights at Nepcon Show
Reed Exhibitions has confirmed that Nepcon 2006 will again feature a complete Lead-Free Experience, presenting engineers with the opportunity to gain hands-on experience with a variety of lead-free materials and production equipment. As one of the key attractions taking place at Nepcon over 9th–11th May, the Lead-Free Experience is a purpose built feature area designed by the Smart Group. Aimed at enabling engineers to build up practical knowledge of the new lead-free manufacturing environment, this forum will also provide participants with a platform from which to pose lead-free questions to a team of experienced industry experts. Process issues to be covered during the informative event include lead-free soldering, inspection, component requirements, product reliability and board design.

As part of the Experience, engineers will be invited to bring along their own board designs to work with. Participants will be able to use production equipment using lead-free alloys, incorporating both surface mount and through whole terminations. Other highlights will include chances to try convection and vapour phase reflow, to inspect and test a range of joints and to learn about inspection criteria. In addition, the Lead-Free Experience will provide a comprehensive knowledge-base, delivering a selection of lead-free process information and process design check sheets. This feature will run alongside the Electronics Process Technology Seminars.
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