At Apex in Anaheim, Soldertec awarded its lead-free solder co-operation award to solder-materials manufacturer Indium Corporation and its customer Motorola. This award recognizes the high-quality collaboration between the two companies which have developed a lead-free assembly process and solder paste that has been used to produce more than 8 million mobile phones. The team shared the process details with the electronics-assembly industry. The result of this co-operation is the Quickstart process, offering practical benefits, including yields and benefits which are equal or better than similar processes using lead-bearing solders (wide process window, component-friendly profiles and no requirement for nitrogen-reflow). It is claimed that Quickstart offers the most robust lead-free assembly process available.
EPP EUROPE 406
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