Koh Young has announced the release of a new case study exploring how a low volume contract manufacturer with an almost fanatical approach to quality used automated solder paste inspection (SPI) to improve the performance of their printing and of their whole process.
PCBX acquired the 8030–3 SPI in 2019 and hasn’t looked back since. The addition of the equipment has more delivered on their expectations, improving their quality, and expanding the performance and life of their screen printer. As Matt Polak, PCBX CEO, says “The SPI saves us money, because nearly all defects caught previously were printer related, and now we eradicate those much earlier. We literally dropped to 0 % rework on most boards after installing the Koh Young SPI.”
Koh Young Americas President said, “We are delighted to be a trusted partner of PCBX as they continue their digital journey”, adding, “it is really pleasing to see customers like PCBX gain even more value from our solutions than they bargained for, we know PCBX will be a long-term Koh Young partners and user.”