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Productronica 2021: IoTech wins awards for multi-material additive manufacturing technology

Productronica 2021
IoTech wins awards for multi-material additive manufacturing technology

ioTech’s open C.L.A.D system allows the deposition of a very wide range of polymers, silicones, ceramic pastes, metal pastes, solders and adhesives Source: ioTech

London-based ioTech, developer of a multi-material additive manufacturing technology that can process almost any industry-certified material at high resolution and high speed, has announced that its technology has won two industry awards at the Productronica trade fair in Munich which took place on 16–19 November 2021. The company picked up the Productronica Innovation Award 2021 in the PCB & EMS cluster for its Continuous Laser Assisted Deposition C.L.A.D system, as well as first prize for the Productronica Fast Forward Award 2021. The system can can print and combine multiple (flowable) materials at high resolution and at high speed, offering the flexibility of dispensing at the speed of screen printing.

“ioTech is honoured to have received the productronica innovation award 2021 that recognises the most innovative new products and manufacturing technique,“ the company said.

“We have worked very hard to reinvent material deposition so we are absolutely thrilled at winning both industry awards,” Hervé Javice, ioTech’s CEO and co-founder, said. “They reflect a true recognition by productronica’s team of experts of our disruptive additive manufacturing technology.

“The summit on climate change just concluded and today. ioTech is making a modest but important contribution with a completely new and greener material deposition technology for the electronics industry. Imagine the throughput of a screen printer with the flexibility of a dispenser and the resolution of an inkjet printer. ioTech’s system can deposit any flowable industrial material with ground-breaking throughput at up to 20mm resolution.

“So, the challenge is now on designers to think out of the box because the box is gone – they are free to innovate with the design they want and the material they need.

“We invite industry leading innovators to come and meet with us. We are keen on helping them to increase density in semiconductor packages as well as boost innovation and productivity in PCB manufacturing and assembly. The possibilities are endless and we cannot wait to share them with visitors at productronica and beyond.”


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