The outcome of UK’s Micro Tech 2006 is that Design, Manufacture and Test for System in Package (SiP) Technologies is creating a demand for complexity that will shortly match that of the chip itself. This offers either a very big warning, or a very big opportunity to the Microelectronics (and Nanotech) Industry. Co-design of chip and package is now a crucial need for advanced microelectronic systems, to ensure optimum functionality on a cost effective platform.
The goal of Micro Tech 2006, organised by IMAPS UK, was to review the state of the art in SiP. The presentations from some of the leading experts in the field of micro engineering from science and industry indicate that SiP products are now providing solutions for all high-tech electronic product designs, such as Ipods and mobile phones. However, the packaging industry is claiming that it can only meet the challenges posed if the package and the chip are designed to work together. System in Package (SiP) and System on Chip (SoC) are directly related and can be combined in any one Package to produce enhanced functionality and performance at optimized cost. In addition, there is no one unique packaging solution for every application, and this has to be judged on the product requirements and best design achievable.
SiP is the enabler for the move to System on Chip. SoC delivers increased functionality and performance in small form factor for mobile communications, resulting in significantly greater adoption rates than any previous multichip module. IMAPS UK considers that this represents the leading edge of technology manufacturing and supports the need for intelligent manufacturing of advanced electronics products and systems. Future products will be more and more enabled by the use of micro-devices and micro-systems, spanning all areas of application and opening new business opportunities. www.imaps.org.uk
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