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Chemical dry film resist chosen

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Chemical dry film resist chosen

Specifically, AT&S choose Photec H-9825 multifunctional resist technology engineered for fine line circuitry down to a 25 micron thickness. The resist’s exceptional tenting capabilities, as well as its ability to meet high density, fine line and space requirements were noted as reasons for selecting the resist.

Additionally, AT&S is currently evaluating Photec DL-1000, a new series of laser imaging dry film that is suited for both 355 and 405 nm applications. The resist’s superior photosensitivity for fast exposure and increased productivity, wide operating window, and excellent adhesion and resolution characteristics have contributed to increased interest from the producer of PCBs.
“AT&S is an impressive organization that we are truly proud to be working with,” said Frando van der Pas, Marketing Manager, Enthone PWB Chemistry – Europe. “The comprehensive selection process they went through to find the best fit for their global manufacturing operations is a reflection of the diligence that has made AT&S one of the largest global producers of high quality PWBs.”
Productronica, Stand B3.406
EPP Europe 406
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