Productronica, the world leading trade fair for electronics production, has closed its gates in Munich, and the exhibitors are drawing their first balances. The company GPS Technologies GmbH from Langen, Germany, the large distribution company which is recognized all over the German speaking region for solutions and services for the electronics industry, was also present again, with innovative process solutions. Their résumé is very positive and can be summarized as follows: “A large number of new contacts have been established, demands have been very well qualified, and many new purchase contracts have been made,” Uwe Podssus and Andreas Gerspach confirmed, both General Managers of GPS Technologies GmbH. They described the quality and quantity of the visitors as “very good”. “A lot of attention was paid to the 100 % 3D-solder-paste-inspection-system, the SE300 Ultra of CyberOptics,” according to Andreas Gerspach. Driving segments for the implementation of this technology are automotive, medical, and avionic. The key benefits of the system are to control and verify the stencil printing process, and in the case of the identification of misprints at an early stage, to discharge the incorrect printed circuit boards off the assembly-line in time. Otherwise, the determined quality data, can be adducted for a statistical process control (SPC) and applied for the optimization of the process of stencil printing, and of overall SMT and general manufacturing yields. The applied 3D-phase shift profilometry delivers three basic characteristics which are demanded by customers: highest accuracy and highest reproducibility at unbeatable speed. For this reason it is certain that even in high-volume assembly production environments, the SE300 Ultra will not become a bottleneck, and the printed soldering paste depots will be measured repeatable even at rock-bottom cycle-time. “The interested visitors were visibly impressed by the speed at which the ambitious printed circuit board had been checked during the 4 days of the exhibition,” Uwe Podssus confirmed. “Furthermore, the participants of the product-demonstrations could satisfy themselves about the outstanding accuracy and repeatability of the SE300 Ultra at our booth. For this purpose we have applied a certified target according to the NIST-standard,” Andreas Gerspach reported. The SE300 Ultra closes an essential gap for users with its 100 % 3D-solder-paste-inspection at the quality control and -protection as well as in the development of process and -guidance. “To introduce new innovative process-solutions to the market, to cultivate existing contacts, and campaigning for new customers has been our ambition, and this has succeeded very well,” Podssus confirmed.
EPP Europe 439
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