Koh Young America recently participated in a two-day technology seminar with other industry-leading equipment suppliers. The event was hosted by Technica USA of San Jose, California. The seminar featured technology presentations from Koh Young Technology, ASM-DEK, ASM-Siplace, and Rehm Thermal Systems, focusing on high-yield SMT production and how to utilize the latest technologies to minimize defects and improve yields. Classroom presentations were followed by live hands-on equipment demos that showed the power of true 3D inspection with Koh Young’s SPI and AOI inspection systems. The team of technical experts was able to demonstrate both their 3D SPI and 3D AOI solutions at Technica’s Demonstration and Training Center. The company demonstrated industry-leading defect detection through 100% 3D measurement and full color inspection. Innovative features included full board foreign material inspection and results traceability from SPI to AOI through KSmart Link software.
Following the seminar, Frank Medina, President of Technica USA, stated, “We were very pleased with the turnout for our annual event. As I have mentioned in the past, Technica believes in adding value to our relationships with our customers. Sponsoring our event every year is one of the many ways in which we demonstrate this commitment.” He added, “Our Technology Forum provides us with an opportunity to expose our customers to the latest technologies available in the market. Our ability to deliver knowledge that is interesting and valuable to our customers is possible thanks to the partnerships we have established with industry-leading companies including Koh Young.”
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