As a manufacturer of machines for thermal process solutions from -50 ºC up to +450 °C, SMT Thermal Discoveries presents its complete portfolio with innovations in the areas of SMD reflow soldering, vacuum soldering, curing and temperature treatment for temperature function tests at the exhibition SMTconnect in Nuremberg.
With the new reflow generation by SMT, the customer receives an improved heat transfer in the reflow soldering system due to the optimized airflow in the proven 3:1 zone concept. Flexible profile settings are easy to implement by combining “recipes” and “products” in the Thermal Tools operating software. The advanced, low maintenance “KAT” process gas cleaning system is integrated directly into the process area and does not require any additional energy consumption. In contrast to conventional process gas cleaning systems, the company has been relying on systems without any complex and fragile tubing for years. The customer benefits and saves not only energy losses in the tubes, but also an annual maintenance that can last several days.
Moreover, the customer can change the catalyst themselves, thereby increasing the availability of the plant again. In the new reflow generation, cooling is done from above and below with one fan per zone only, which means better cooling performance with consistently low power consumption. The customer also benefits from the flat heat exchanger plates, which are easy to clean and do not “foul”. The constant cooling capacity, regardless of the degree of pollution, is another plus of the cooling. The use of one type of seal for the entire system is an innovation in the maintenance concept. The seal is not glued but clamped. This makes replacement very easy and quick and there is no need to store different types of seals. The advantage of the process area without physical zone separation is a large and easy to clean surface. Large filter surfaces for long maintenance cycles and the maintenance, which can be done from the front of the system, complete the improved maintenance concept.
The vacuum reflow soldering system offers void-free soldering, precise nitrogen control and individually adjustable parameters (evacuation time, vacuum holding time, ventilation time and vacuum pressure). It also has the following advantages: fast cycle times and reliable transport handover in the system. Now all of the company’s vacuum reflow soldering systems can be controlled with the intuitive operating software „Thermal Tools“. With a 2-level structure, the correct page is achieved with only 2 clicks. With barcode and MES connection as well as with the new remote maintenance system „Smart Access“, SMT points the way to the Smart Factory from the aspects of Industry 4.0.
The newly developed vertical oven (VH8) is designed for product-specific curing and perfect heat treatment for electronic components and modules. The highlights of the systems are the small footprint (up to 86 % space savings compared to horizontal ovens) and the modularly, expandable system. A flexible reaction regarding to quantities, as well as the lean concept which enables loading and unloading at one place are further highlight of the system. The machine is available as an inline or batch system.
SMTconnect, Booth 4–149