Kurtz Ersa North America, a supplier of electronics production equipment, has recently introduced new rework systems and a mobile optical inspection system.
The HR 550 hybrid rework system features a 1,500 W high performance hybrid heating element to de-solder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly. The system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications.
The i-Con Vario 4 offers whisper-quiet air and vacuum generation for up to four simultaneously operating soldering and de-soldering tools. The station ensures highly efficient processing of all SMT and THT soldering tasks. In addition to the 200 W i-Tool Air S, it offers the i-tool universal soldering device, the THT de-soldering X-tool iron, and the ultra-fine de-soldering chip tool Vario (2 x 40 W).
The company’s Mobile Scope has been designed for optical inspection and digital image recording including measurements of solder joints on Ball Grid Array (BGA), µBGA, CSP and flip-chip packages. Further applications are top-view inspection of PCB lands, solder paste prints or the optical inspection of components on printed circuit boards in SMT or in THT. The device can be used in quality control, production, laboratories or R&D departments.
