Viscom’s comprehensive line of optical and X-ray inspection solutions covers all examination needs in the SMD production sector. The portfolio encompasses AOI systems as well as high-resolution systems for X-ray inspection – from fully automatic in-line solutions to manual and semi-automatic X-ray inspection with the X8000-series systems. The X8011 PCB X-ray inspection system was specifically developed for assembly inspection, providing maximum granularity and highest image quality. The XMC analysis software allows for convenient operation, containing several automatic analyses such as BGA, QFN and inspection, as well as void calculation. The company now offers a verification terminal link with XMC that is identical to the in-line system’s standard issue. Hereby, detected defects are vividly represented and the operator can verify them precisely assisted by diverse high-resolution views. All data and images of the type of defect can be stored and, when needed, called up over the traceability system. This ensures process security and alleviates inspection verification, i.e. by audits. An feature of the system is that defects that evade conclusive identification can be directly and automatically pinpointed for detailed examination, i.e. with an inclined view or zoom enlargements.
Electronica, booth A1.217
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