The Schmid Group presented its new module line generation InfinityLine on the leading trade show for PCB during productronica in Munich (Germany). Furthermore, innovative etching solutions made by the company, which fundamentally improve the etching result, were introduced under the title „NEO“ (New Etching Options).
The InfinityLine is the combination and innovative optimization of the Schmid CombiLine and PremiumLine. In addition to the proven quality and performance of the company, it offers several new highlights which are to the benefit of our customers. For instance, the InfinityLine offers an especially high user friendliness since measured values can be digitally recalled via a user tablet or externally via internet browser. In addition, optimized module lengths and the use of intermediate plates result in a significant reduction of chemical drag-out, leading to cost savings on the part of the customer and to an increased environmental friendliness. With this solution PCB manufacturers are prepared for the future, since the new module line generation not only meets current but also future energy efficiency standards (such as IE3 and IE4); and thanks to numerous constructive measures the line has a particularly low wear and a considerably longer service life compared to the competition. Furthermore, the modular design of the line provides the opportunity for simple and cost effective technology upgrades, which sustainably secures the competitiveness of our customers.
Under the term „NEO“ (New Etching Options) the company offers several optional expansions that significantly improve the etching result. This also includes a process phases optimized nozzle arrangement for a higher etching performance and the option of vacuum etching which is suitable for the etching of particularly fine structures and significantly contributes to increase the standard distribution and to improve the etching factor. Another „New Etching Option“ is provided by the expanded Fluid Dynamic Equipment, which significantly reduces defects during etching and enables a significant increase in yields, especially with ultra-fine structures. Moreover, the company now offers an expansion of the pressure range to a maximum of 4 bar spraying pressure and an optimized transport system which ensures more uniformity during etching.
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