Orthodyne Electronics’ new high density series wire bonders are designed to address the demand for smaller, thinner and denser discrete power semiconductor packages such as SO-8, PDFN, PQFN, DSO and DrMos. The trend to shrink the size of power packages is driven by requirements of space-critical end applications such as hand-held devices, and is enabled by the ongoing substantial improvements in silicon efficiency. Smaller chip sizes allow multi-chip packaging, which perform functions once done with multiple devices or hybrid circuits. Squeezing more power and functions out of smaller packages increases the complexity of the devices. The advanced leadframe handling and clamping capabilities of the HD Series overcome the interconnect challenges, while providing better electrical performance, higher reliability and lower cost than other techniques.
SMT/Hybrid/Packaging Booth 7-322
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