Shenmao America, Inc. introduces SMF-WC53 water soluble ball-attach flux and solder sphere for use in ball-attach processes. With excellent solderability and high reliability, the solder sphere can be used in a wide range of solder applications with various sizes from 50–760 μm.
As the last process step in forming electrical and mechanical connections, the ball-attach process has an important impact on the overall product yield and cycle time. The industry’s most popular ball-attach technology involves using paste flux and a solder sphere. The company offers industry-leading fluxing technology to ensure effective assembly.
SMF-WC53 flux is a halogen-free, water-soluble flux designed for use in ball-attach processes. This flux is also ideal for printing and transferring applications as it offers excellent solderability on all substrate surface finishes. Additionally, the company’s high reliability series solder sphere has exceptional thermal and impact reliability, offering exceptional performance.
