Supplier of copper clad laminates and prepreg bonding materials to the global PCB industry Ventec International has announced it will premiere its ‘aerolam’ base material solutions set in the US market during the IPC Apex Expo 2022. According to the company, aerolam was specifically curated for the diverse and unique requirements of aerospace and defense applications. “From 25 to 27 January, the Ventec team will be on hand at booth #3325 for the unveiling of aerolam and to showcase its laminate and prepreg capability across a very wide range of applications and budgets,” the company said.
“The evolution of aerospace and defense (A&D) electronics is accelerating at a staggering pace, driving the demand for reliable high-performance materials that maintain mechanical and electrical integrity in harsh mission-critical operating conditions. Paying attention to the properties of materials at the substrate level is the first step towards achieving the most stringent performance targets of today‘s A&D manufacturers.
“Whatever the substrates must handle – high-speed digital signals, high RF frequencies, intense heat dissipation, extreme environmental stresses – the aerolam portfolio guides designers and manufacturers of high-performance A&D electronics to high-quality products that are ready to meet those demands and are supported by all the necessary documentation including test schedules and certificates of conformity.
“The aerolam portfolio caters for the complete spectrum of A&D application scenarios, from equipment intended to operate in a relatively benign environment such as inside a command-and-control center, to high-performance fielded systems that must withstand the toughest conditions including extreme temperatures, high vibration and g-forces, salt spray, and humidity that challenge reliability to the utmost.”