In power electronics and high reliability technology, void-free solder joints are being demanded to an ever greater extent. This is only possible if the solder is subjected to vacuum while it’s still molten after the solder joint has been produced. Highly void-free solder joints with greater than 98% contact are achieved with underpressures of below 50 mbar. In order to achieve this goal, Rehm has combined condensation soldering technology (vapor phase soldering) with suitable vacuum technology. In Rehm’s Condenso Vacuum systems, the soldering process is first of all controlled by injecting defined quantities of the utilized medium into the process chamber, thus generating a specified amount of heat. Soldering is immediately followed by a controllable vacuum process. Condensation-vacuum technology is available for process temperatures of up to 240° C. For even higher temperatures, Rehm offers a combination of convection soldering and vacuum technology. The VAC 400 Vacuum System is laid out for temperatures of up to 400° C, and can be operated with air, nitrogen or forming gas.
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