Vacuum plus is a forward-looking system for optimising soldering joints, that has been developed by the Wertheim-based SMT. As the name implies, any inclusions (bubbles) are eliminated in a vacuum chamber, which significantly improves the quality of the soldered products. This has been eagerly awaited, particularly by sensitive industries such as high-performance electronics, automotive, medical, aerospace and defence, in which soldering joint reliability has top priority. Vacuum plus, which is an in-house development, is an autonomous module and can be integrated in an SMT reflow soldering system. Due to the modular design of the SMT reflow soldering systems the system can be retrofitted in existing machines without problems. Vacuum plus is inserted immediately after the peak zone, and can be enabled when required. The continuous reflow pass is then automatically changed to vacuum operation. The product is subjected to a vacuum for a short period during the soldering process. Inclusions in the soldering joint are reduced to a minimum, which improves the quality of the product significantly. Direct integration in the system gives the user a high degree of flexibility, and is sig- nificantly cheaper than a separate system.
SMT/Hybrid/Packaging
Booth 9-128
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