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Thermal profiling system

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Thermal profiling system

The SolderStar PRO thermal profiling system features an ultra-miniature datalogger that will enhance the performance and capabilities of the company’s profiling range. Measuring just 100 mm x 50 mm x 9 mm, it offers a flexible solution to reflow, wave and continuous profiling through its Smartlink connection system. High speed USB connectivity is utilised for reduced data download times and to provide power to recharge the internal high temperature battery, all from one standard USB cable. As part of a pass-through reflow profiling system, the datalogger attaches by way the connection system to a range of adapters which provide between 6 and 16 measurement channels in a variety of configurations. The system allows the channel count to be upgraded in line with the growing complexity of current and future assemblies. Protected by an upgraded heat shield system, this system makes light work of lead-free operation whilst maintaining a small footprint for carrier-free operation in restricted tunnel height machines and on narrow PCB applications. When fitted to the WaveShuttle, the datalogger becomes a high-end wave solder analyser capable of accurate, repeatable analysis of the problematic wave solder process. The WaveShuttle fixture is purpose-made for wave solder analysis to which the datalogger is attached, again by way of the Smartlink. For this application, the datalogger monitors top and bottom preheat temperatures, solder pot temperatures and chip and main wave contact over multiple points through the wave. Along with dedicated wave solder PC software, the system offers users automatic graphical process analysis and process SPC capabilities in an easy-to-use package.

EPP Europe 435
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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