Vi Technology, a provider of state-of-the-art inspection systems for the SMT industry, announces that it will demonstrate the Pi SPI system, Sigma Review Software and 8K Spectro AOI system during Nepcon South China. Pi is innovative, intelligent and intuitive, and allows the customer to see and measure the print process like never before. With 360° Moiré technology, it is the first SPI to use angle cameras to measure the solder paste deposit. Taking about 352 images per field of view, and thanks to the amazingly powerful computing system (100 times more computing power than conventional solutions), the solution provides an ultra large image in 3D true color. It offers a large PCB capability (up to 533 x 600mms) within a very small envelope (only 800mms wide), responding to the increasing constraints on floor space in modern SMD lines.
Sigma Review (3P review) is a new multi-process review software. The software allows the user, when he checks the products at post-reflow inspection, to access information from the post-print inspection or post placement inspection. This provides valuable information about the process as the user can check if the defect caught post-reflow is caused by the print process or not (all pictures and data are stored even for good print processes). Thus, if needed, the user can adjust his print process inspection (tolerances) in order to catch defects at that stage (more costly effective solution).
Also on display, the 8K Spectro AOI is compliant with the widest range of pick-and-place systems on the market, including those with front and rear fixed rails. The dual lane system is completely flexible as the user can manage fixed rails and moving rails. The system can accommodate board sizes in two lanes up to 21L“ x 12,8W“ or 21L“ x 23,6W“ in single mode.
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