Martin demonstrated the Prebump/Reball 03.1 unit which can ahandle the complete QFN solder bumping process, even for the smallest pitches. Using a unique hotprint technology, the mask is not removed after printing paste, but remains on the QFN during reflow. The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple rapid technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain within a safe temperature zone.
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