Increasing quantities and continuous price pressure, resulting in cost reduction programs, is driving the die size of photonics components, especially LEDs, further down. Efficient die separation with very small com-pound semiconductor devices is becoming therefore more and more an issue. The advanced design of Dyn Test Technologies‘ break module is already able to break dies as small as 200 x 200 µm, even if relative thick in relation to their size. To extend this capability also to laser prescribed sapphire wafers of high bright LEDs, the break module has been substantially enhanced in force and cycle time, not only able to break the stronger material but also to increase the throughput. The semi-automated breaker model DB-6100 will be also available as fully automated solution including cassette-to-cassette wafer handling.
EPP Europe 447
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