With the new Mark III series Heller Industries announces a new reflow soldering technology. With over 12,000 systems installed worldwide, the company has been at the leading edge of forced hot air reflow soldering technology development since 1987. Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications. The Mark III system is yet another major advancement with innovative technologies including lead free certified systems. Heller has pioneered the lead free reflow process by working closely with the Japanese OEM’s and International ODM’s and EMS’s to refine the process. The Mark III system includes features that provide: Spike Zone design to minimize liquidous time. Ultra fast cooling rates of 3 to 5 Deg/Sec formes perfect grain structure. The new gen 5.2 and 9.2 flux removal systems virtually eliminate flux from the heated tunnel and reduce maintenance time from hours per month to brief times per quarter. Flux is captured in jars so it can easily be seen and quickly cleaned. Valuable production time is re-captured due to the huge decrease in maintenance.
SMT/Packaging/Hybrid
Booth 7-320
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