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Solution for issues with die attach reliability in high volume manufacturing

Sintering technology for power semiconductor
Solution for issues with die attach reliability in high volume manufacturing

Solution for issues with die attach reliability in high volume manufacturing
The company‘s sintering technology products. Source: Alpha Assembly Solutions

Alpha Assembly Solutions, a producer of electronic soldering and bonding materials, has recently introduced their latest technology developments, including their sintering technology products and a no-clean solder paste.

The company’s sintering technology is a range of products designed to meet the demanding quality standards of the power semiconductor and LED industry. These products include Argomax which has been specially designed for low pressure sintering die attachment.

“Argomax in paste, film and preform technologies, provides high thermal and electrical conductivity silver bonds, high reliability and flexible bondline thickness,” explains Julien Joguet, Global Product Manager for Sintered Materials, a MacDermid Performance Solutions business. “This addresses issues with die attach reliability in high volume manufacturing and challenging Si/SiC/GaN die attach processes.”

As well as advancements in sintering technologies, the company’s latest new cleanable, no-clean material, OM-347 solder paste. The product has been designed to print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. This solder paste has been tested to give excellent printing performance and an outstanding reflow process window. After reflow, the resulting residue produced can be safely left on the board, or if needed, it can be very easily cleaned with a broad range of solvents.

www.alphaassembly.com

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2022
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