Alpha Assembly Solutions, a producer of electronic soldering and bonding materials, has recently introduced their PowerBond solder preforms for high temperature, high reliability, lead-free interconnects for automotive and power semiconductor applications.
“Alpha PowerBond preforms contain approximately 5–10 % of Antimony (Sb), which enable solder joints to have increased strength, thermal fatigue resistance and higher liquidus temperatures, compared to traditional tin/silver/copper-based lead-free systems”, said Gyan Dutt, Global Portfolio Manager for Die Attach Solutions. “These preforms can also be customized with TrueHeight preforms technology for bond-line thickness and tilt control or can be pre-coated with AccuFlux, an ultra-low voiding flux formulation, for difficult-to-solder surfaces”.
- PowerBond 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for power semiconductor devices.
- PowerBond 2100 preforms provide highest creep resistance and tensile strength for high operating temperature applications.
- PowerBond 2050 preforms expand upon industry standard Sn95Sb5 alloy to provide improved wetting characteristics.
