Alpha Assembly Solutions, a producer of electronic soldering and bonding materials, is introducing Alpha OM-550, a low temperature chemistry paired with the HRL1 alloy for assemblies with temperature sensitive substrates, components, and high warpage chips.
“The HRL1 alloy was designed to enable near-SAC305 drop shock and improved thermal cycling performance in low temperature assemblies”, said Phua Teo Leng, Global Portfolio Manager for SMT Assembly, a part of the MacDermid Performance Solutions Group of Businesses. “This chemistry and alloy pairing is revolutionary as it reduces the soldering temperature required for SAC alloys by 50 °C, while dramatically reducing power consumption and carbon emissions. Assemblers can now benefit from having a cost efficient, highly reliable soldering process with up to 99% less warpage and significantly fewer defects, which is truly unique”.
This alloy has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures, therefore minimizing NWO and HIP defects in complex assemblies.
