AIM Solder, a global manufacturer of solder assembly materials, will feature their revolutionaryM8 no clean solder paste along with their full line of solder assembly materials at the productronica 2015 trade show. The company has strengthened its commitment to the European market with the expansion of its European sales and support team in recent years. The entire European team, with a depth of industry expertise, will be in attendance to share information about the company’s growth and its world class products. The M8 no clean solder paste will be among the highlighted products. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduces voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be safely left in place.
Additionally, the company will highlight its liquid fluxes, tin/lead and lead-free alloys, including SN100C.
productronica, Booth A4.531
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