Indium Corporation, a materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has released Indium11.8HF-SPR (T5-MC) Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.
This solder paste specifically addresses the move toward type 5 powder. It delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.
The 11.8HF-SPR benefits:
- Halogen-free per IEC 61249–2–21 test method EN14582
- High-transfer efficiency through small apertures (≤ 0.66AR)
- Long stencil life (12 hours)
- Eliminates hot and cold slump to inhibit bridging and solder beading defects
- Avoids the potential for HIP and graping defects with a unique oxidation barrier
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