Provider of solder products, Shenmao America, has released a Joint Enhanced Solder Paste (JEP) called PF606-EP305 which it says offers the advantages of both conventional solder paste and anisotropic conductive paste, self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
The new epoxy-based solder material is designed for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly. It is compatible with various surface finishes, with a transparent residue and no cleaning required.
Shenmao’s JEP is both lead-free and halogen-free. Halogen can generate hazardous gas at high temperature and the use is restricted. Shenmao halogen-free JEP materials meet J-STD standard (≤1000ppm Chlorine/ ≤1000ppm Bromine) and IEC standard (≤900ppm Chlorine/ ≤900ppm Bromine/ ≤1500ppm Total halogens).
The company says it strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. Shenmao America blends SMT solder paste at its facility in San Jose, CA for distribution in North America.