Shenmao America has launched a thermal fatigue resistant lead-free solder paste known as PF918-P250. The company says the new paste is formulated with its new Sn/4Ag/3Bi alloy design with high thermal impact reliability.
According to Shenmao, the new solder paste can increase thermal reliability performance by a minimum of 30 percent. It provides better mechanical shock performance than typical solder alloys such as SAC305 and SAC405, and is suitable for use in consumer electronics, servers and automotive electronics applications. It has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied. With the flux design, voiding can be easily controlled to less than 10 percent.