Universal Instruments expands its Genesis Platform portfolio with the introduction of the GenesisSC Platform – a Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform. GenesisSC has the inherent capability to provide a complete solution for any production environment. This platform has been tailored to place dies and passives precisely while promoting high yields and reliability at the lowest possible cost. The combination of 300 mm wafer capabilities and industry’s fastest flip chip throughput, along with Universal’s standing reputation for robustness, creates an industry-leading value for the customers. Because this new Semiconductor technology was developed from Universal’s base Genesis Platform, GenesisSC is able to leverage patented VRM (Variable Reluctance Motor) technology, which is the core of all Universal platforms. When coupled with Universal’s high-precision multi-spindle placement heads, it delivers a one-of-a-kind high-accuracy product offering with placement capabilities down to ±10 micron @ Cp>1. The GenesisSC Platform software has also been enhanced to feature greater ease of use to support Semiconductor applications.
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