Henkel´s line of materials known as self-filleting die attach reportedly offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and less costly alternative to die attach films. Device technologies have dictated the need for much thinner die in packages with tighter geometric tolerances. For these applications, conventional die attach pastes can be hard to control, with uniform bondlines and complete wetting becoming very difficult to achieve. These challenges have proliferated the use of die attach films, which are effective but can cost as much as 50% more than traditional die attach pastes. To address these issues and respond to industry requirements for a cost-effective alternative to film-based materials, Henkel has designed a die attach paste technology that utilizes capillary force to control flow and deliver complete wetting. Unlike conventional die attach materials that rely on complicated dispense patterns in combination with die placement force to encourage flow, determine bondline thickness and promote wetting, the capillary function controls these critical process parameters. Self-filleting die attach technology is a big advancement.
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