IPC, the leading organisation for standards and guidelines within the production of electronic assemblies, published the standard „IPC 7526“, which describes measures for the reliable cleaning of stencils and misprinted assemblies. Solder paste residues, which remain in fine-pitch apertures after manual cleaning, cause inconsistent print images and thus can lead to bridges and solder balling between solder joints.
“IPC 7526” therefore recommends automated cleaning processes for SMT stencils instead of manual cleaning to achieve optimal and reproducible cleaning results. An automated process is generally the method of choice for cleaning misprinted assemblies. In the case of manual cleaning solder balls are smeared across the entire assembly, thus influencing its reliability later on. For the use of cleaning media in automated processes, the „IPC 7526“ defines parameters, which can all be met by the water-based stencil and misprint cleaning agents from Zestron.
EPP Europe 531
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