Rehm Thermal Systems has launched the latest of its high performance vapor phase reflow systems. The CondensoXS reduces floor space by 25% while completely maintaining the process capabilities of the rest of the product line. Evolving electronics assembly and repair operations are faced with ever-decreasing pitch sizes, shrinking thermal envelope margins, and temperamental lead free paste formulations. Products with large thermal mass further stress existing reflow processes. Rehm’s CondensoX Series vapor phase condensation reflow soldering systems provide solutions to these and other complex reflow problems. The evolution of electronic packaging and the requirements for more uniform heating have led to the re-emergence of Vapor Phase Technology. State of the art vapor phase systems enable the use of lower temperature to transfer higher volumes of thermal energy, thereby reducing stress on boards and components and improving the reliability of solder interconnections. The patented CondensoX process is at the cutting edge of the technology. The use of the injection principle and the control both of the temperature and the pressure (vacuum) allows a more precise and more diverse reflow profiling. Measuring the complex requirements of lead-free soldering of units with high thermal mass, the system can solder even the heaviest units quickly and reliably for maximum return. Profiling with the principle of injection is extremely simple, enabling optimal profiling in only three steps, five with optional void reducing vacuum. Horizontal transport of the assembled board prevents components from slipping, reducing reject rates rework requirements.
Best-in-class energy efficiency is a studied characteristic of all reflow systems from the company and the CondensoX-Series is no exception. And now, this system is also available in a smaller version, saving as much as 25% space, with board loading carried out at the front, underneath the cooling system. As the re-emergence of vapor phase technology continues to pick up momentum, the system’s reflow technology is meeting the challenges of new packaging, lead free conversions and high thermal mass assembly.
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