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Promoting better energy transfer with selective soldering

Economical soldering system
Promoting better energy transfer with selective soldering

Promoting better energy transfer with selective soldering
Seho’s redesigned wave soldering system GoWave features an extended reflection tunnel over both the preheat area and the solder pot to promote better energy transfer to the board. The cabinet has also been modified as one unit, rather than two separate units. Ideal for low-volume production for both leaded and lead-free applications, the GoWave is a powerful yet economical soldering system for those just entering mass-soldering applications.

 
The system is suited for soldering of small to medium-size batches and also provides a cost effective solution for universities, schools and laboratories. GoWave also features a fluxing module, an innovative soldering area and a microprocessor control. As an additional benefit, the redesigned system features a new spray flux nozzle with HVLP technology to control the quantity and spray pattern of the flux. A new PCS 707 touch-screen controller and USB interface have also been added and servicing the system has been made much easier by locating the service points for the fluxer and compressed air directly at the inlet section of the machine.
 
The selective soldering system, PowerSelective, is an all-in-one system offering highest flexibility, maximum soldering quality and completely reproducible soldering results. Its modular design ensures high flexibility and the machine system can ideally be configurated to meet different specific production requirements as well as process both bare boards and assemblies in carriers. Depending on the application, PowerSelective can be equipped with an inline conveyor for integration into a fully automated production line or with a batch conveyor module for stand alone operation. A highly precise double portal axis system with servo drives ensures an exact and reliable positioning of the assemblies at the various work stations with a positioning accuracy of ± 0.1 mm. The gripper unit is provided with a pneumatic rotating function up to 270° and can be tilted up to 12° to obtain an ideal solder angle.
 
Seho’s SelectiveLine is a cost effective selective soldering system featuring the miniwave process, which favours the machine to be used for high product mix with small to medium production volumes. This machine concept offers a maximum of flexibility and may be upgraded individually if production volumes should increase. The SelectiveLine concept covers three basic modules: the SelectiveLine soldering module, a separate fluxing module and a preheat module. These modules may be arranged individually or as a complete production line. The system allows flexible processing of bare boards or carriers up to 500 x 500 mm with absolutely reproducible results. For highest process reliability the SelectiveLine is featured with a fiducial recognition function for automatic PCB alignment, process visualization, a comfortable, easy to use offline teach program and many other features.
 
The reflow soldering system GoReflow 2.3 is ideally suited for small to medium-sized production series and can be integrated into a fully automated production line. With a heating zone length of 2350 mm (92.5“), GoReflow 2.3 is not only featured with an attractive design, above all the system excels with its well-engineered concept and excellent soldering results. GoReflow 2.3 features 7 heating zones that provide maximum flexibility in temperature profiling, particularly for the lead-free soldering process. Designed for soldering in ambient atmosphere, GoReflow 2.3 also features a flux management system and closed loop controls and offers a choice of different conveyor concepts depending on the production requirements.
 
The repair system PowerRepair is designed for professional desoldering and soldering of through-hole components. The system features the well-known wave soldering technology to enable desoldering and soldering of components with a high number of pins and multiple pin rows, such as connectors. Even assemblies with high thermal mass, like multilayer boards or thick pins, can easily be processed with the PowerRepair, also when using lead-free solder alloy. The system provides short repair cycles and offers low thermal stress for both the printed circuit board as well as the components.
 
SMT/Hybrid/Packaging
Booth 9-540
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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